这是描述信息

What gas is used for semiconductors? Application of specialty gases in the semiconductor industry

(Summary description)

What gas is used for semiconductors? Application of specialty gases in the semiconductor industry

(Summary description)

Information

Special gas is an indispensable silicon-based support source material in the fields of optoelectronics, microelectronics, etc., especially for ultra-large-scale integrated circuits, liquid crystal display devices, amorphous silicon thin-film solar cells, semiconductor light-emitting devices, and semiconductor materials. Its purity and cleanliness directly affect the quality, integration, specific technical indicators and yield of optoelectronics and microelectronics components, and fundamentally restrict the accuracy and accuracy of circuits and devices.

 

Semiconductor lighting is an industry in the ascendant. With the expansion of the compound semiconductor market, the demand for specialty gases has shown greater growth, and epitaxial growth requires a large amount of ultra-pure source and process gases. Currently, Taiwan and Japan have a relatively high market share of compound semiconductors. In recent years, China and South Korea have enjoyed strong development momentum, and their share in North America and Europe has also increased. Special gases used in semiconductor technology have a wide variety and strict quality requirements. Production, filling, transportation, and storage all have technical and safety requirements. Coupled with economic scale and other factors, it requires accumulation in many aspects to achieve scale. Production, therefore, the current domestic market is large and the supply capacity is small.

 

The semiconductor industry uses a wide variety of gases, high quality requirements, and a small amount, most of which are toxic or corrosive gases. There are more than one hundred varieties. The classification of special gas applications in the semiconductor industry mainly includes:

1. Silicon group gas: silicon-containing silanes, such as silane, dichlorodihydrosilane, disilane, etc.

2. Doping gases: gases containing atoms of group III and group V such as boron, phosphorus, and arsenic, such as boron trichloride, boron trifluoride, phosphorane, arsine, etc.

3. Etching cleaning gas: mainly containing halide and halocarbon compounds, such as chlorine, nitrogen trifluoride, hydrogen bromide, carbon tetrafluoride, hexafluoroethane, etc.

4. Reactive gas: mainly carbon-based and nitrogen-based oxides, such as carbon dioxide, ammonia, nitrous oxide, etc.

5. Metal vapor deposition gas: containing metal halide and organic alkane metals, such as tungsten hexafluoride, trimethylgallium, etc.

 

In the LED industry chain, epitaxial technology, equipment and materials are the key to epitaxial wafer manufacturing technology. The current MOCVD process has become the basic technology for manufacturing most optoelectronic materials. The ultra-pure special gases required by epitaxial technology include high-purity arsine, high-purity phosphorane, and high-purity ammonia. Silane N-type doping is used in the production of gallium arsenide, while hydrogen chloride and chlorine are often used as etching gases, while argon, hydrogen, and nitrogen are used as etching gases. It is a necessary carrier gas. At the same time, the organic sources needed for epitaxial growth are mainly trimethylgallium, trimethylindium, trimethylaluminum, diethylzinc, dimethylzinc, magnesium cerene and so on. The development of existing technology has increasingly higher requirements for the quality of these products.

 

In the semiconductor compound production process, in addition to the pure specialty institutes, some mixed gases are also required, mainly including SiH4/H2. Although the amount of SiH4/N2 used as the film forming source is not large, the product quality requirements are extremely high. The dew point is below -95℃, only in this way can the yield of epitaxial wafer growth be guaranteed.

 

The expansion of the compound semiconductor industry has led to a rapid increase in the raw material market. The demand for wafers, substrates, etchants, process gases, organometallic compounds, testing and packaging materials, etc., is increasing at an annual rate of approximately 21%, while process gases ( Arsine, phosphorane, ammonia, argon, hydrogen, nitrogen, hydrogen chloride, chlorine, etc.) account for 8% of the total raw material consumption.